Title:
SEMICONDUCTOR CARBON FILM, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CARBON FILM
Document Type and Number:
Japanese Patent JP2009231810
Kind Code:
A
Abstract:
To provide a semiconductor carbon film, and a semiconductor device that may be easily manufactured at low cost and whose band gap may be easily controlled, and a method of manufacturing the semiconductor carbon film.
The semiconductor carbon film consists of polycyclic carbon having bond and containing at least any of five-membered ring, six-membered ring, and seven-membered ring; and hydrogen and/or nitrogen bonded to the polycyclic carbon. When the polycyclic carbon is assumed as 100 pts.wt, the amount of hydrogen and/or nitrogen is 5 to 20 pts.wt.
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Inventors:
KAWAI SHOICHI
Application Number:
JP2009014643A
Publication Date:
October 08, 2009
Filing Date:
January 26, 2009
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L31/04; C23C16/26; C01B31/02
Domestic Patent References:
JP2005322877A | 2005-11-17 | |||
JP2003051603A | 2003-02-21 |
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation