Title:
SEMICONDUCTOR CHIP COOLING STRUCTURE
Document Type and Number:
Japanese Patent JP3196762
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor chip cooling structure which efficiently cools a semiconductor chip without damage under the pressure for fixing a heat sink.
SOLUTION: With a small wiring board 2 provided with at least one through hole, a protrusion provided to a heat sink 4 has such size as allowed to be inserted in the through hole, the protrusion is connected to a semiconductor chip 1 through a heat-conductive material 5, and the heat sink 4 is fixed to a large wiring board 3 with a fixing screw. With this configuration, the semiconductor chip 1 is held with the large wiring board 3 through the heat sink 4, preventing damage to the semiconductor chip 1 under the load for fixing. The surface of semiconductor chip 1 is connected to the protrusion of the heat sink 4 through the heat-conductive material 5 so that the heat generated at the semiconductor chip 1 is efficiently conveyed to the heat sink 4, allowing more efficient cooling than that from backside.
Inventors:
Renya Ikeda
Application Number:
JP11293899A
Publication Date:
August 06, 2001
Filing Date:
April 20, 1999
Export Citation:
Assignee:
NEC
International Classes:
H01L23/36; H05K1/18; H01L23/367; H01L23/40; H05K1/02; H05K1/14; H05K3/34; (IPC1-7): H01L23/40
Domestic Patent References:
| JP685120A | ||||
| JP8222671A | ||||
| JP53119677A | ||||
| JP888302A |
Attorney, Agent or Firm:
Takao Maruyama