PURPOSE: To mount a plurality of semiconductor chips compactly in a small space of an island, while in the conventional method semiconductor chips are mounted only on one side of the lead frame, which requires the mounting space corresponding to the numbers of the semiconductor chips to be mounted.

CONSTITUTION: In a semiconductor chip double mounting lead frame where islands 1, inner leads 2, and outer leads 3 are provided to mount semiconductor chips D on both sides of the islands, each of the inner leads 2 having a plurality of leads, which faces each other with a space on the circumference of the island 1, is provided with a short terminal 23 which is shorter than a long terminal 22.