Title:
SEMICONDUCTOR CHIP AND ITS CRACK DETECTING METHOD
Document Type and Number:
Japanese Patent JPH07193108
Kind Code:
A
Abstract:
PURPOSE: To detect cracks of an insulation film and passivation film on a semiconductor substrate in a short time with precision.
CONSTITUTION: In the vicinity of the outer periphery of multiple semiconductor chips 10 formed on a wafer 12, conductive layers 14 and 18 which connect electrically two wiring pads 22 and 24 along the almost entire that periphery are provided. After the wafer 12 is diced, the conductive layers are electrically monitored so that the crack of semiconductor chip 10 is detected.
Inventors:
ONOZAWA SACHIKO
Application Number:
JP32946093A
Publication Date:
July 28, 1995
Filing Date:
December 27, 1993
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/66; H01L21/301; (IPC1-7): H01L21/66; H01L21/301
Attorney, Agent or Firm:
Takashi Ogaki
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