To solve a problem in which edges of adjoining chips touch each other and cracking is produced when a plurality of semiconductor chips are arranged in a manner that they are almost close to each other, and chipping is apt to be produced when a semiconductor substrate is cut.

This semiconductor chip is provided with a projection 34 that an end face of the semiconductor chip 35 partly overhangs outward the surface of the chip and the rear surface thereof. This semiconductor chip 35 can be mounted in a manner that the projection 34 is arranged in contact with each other. When the semiconductor chip 35 is cut off from a semiconductor substrate 31, a dicing blade 33 in which an inclining angle is set so that an edge on the surface side of the semiconductor chip 35 may has an acute angle, is used to form a shallow cutting groove, and then the slightly outer side from the surface side is cut by the dicing blade 33 having an inclining angle equal to that of the above until the cutting groove reaches the rear surface of the substrate.