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Title:
半導体チップ装着用パッケージ、半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP3554640
Kind Code:
B2
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Inventors:
Kenji Kuwabata
Masayuki Kondo
Application Number:
JP26897296A
Publication Date:
August 18, 2004
Filing Date:
October 09, 1996
Export Citation:
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Assignee:
Mitsui Chemicals, Inc.
International Classes:
H01L23/04; H01L23/50; H05K3/34; (IPC1-7): H01L23/50; H01L23/04
Domestic Patent References:
JP60189940A
JP8023085A
JP6097349A
JP6085097A
JP6069482A
JP6005726A
JP2005553A
JP1011356A
JP10504137A
JP61066870U
Attorney, Agent or Firm:
Tsutomu Toyama
Hidemi Matsukura



 
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