PURPOSE: To obtain the semiconductor chip removing device capable of eliminat ing the smoothing step of the residual resin on the substrate side and the dust cleaning step after chip removing step by a method wherein the title device is provided with a specific chip removing tool and a dust suction cover.
CONSTITUTION: The title semiconductor chip removing device is provided with a chip removing tool 1 having a cylindrical hole from bottom surface to top surface and multiple protrusions 3 on the bottom surface and a cylindrical shaft in smaller diameter than that of the cylindrical hole in the perpendicular direction to the top surface having a hole penetrating through the shaft also provided with a box type dust suction cover 12 having an aperture part on one surface, an insertion through hole of the shaft on the opposite surface to the aperture part as well as a vacuum suction through hole 11 on either one surface. Furthermore, the shaft of the tool 1 is inserted into the insertion through hole of the cover 12 to make the cover 12 contain the tool 1 while a stopper in diameter larger than that of the shaft is arranged on the protrusion from the cover 12 of the shaft so that the tool 1 may be fixed to the cover 12.
FUJIMOTO HIROAKI
NAGAO KOICHI
UMEDA SHINJI
