Title:
半導体回路
Document Type and Number:
Japanese Patent JP4685883
Kind Code:
B2
Inventors:
Suzuki Toshihide
Application Number:
JP2007553796A
Publication Date:
May 18, 2011
Filing Date:
January 12, 2006
Export Citation:
Assignee:
富士通株式会社
International Classes:
H03M5/06; H04L25/49
Domestic Patent References:
| JPS55159660A | 1980-12-11 | |||
| JPS5887947A | 1983-05-25 | |||
| JPH0234036A | 1990-02-05 | |||
| JPS5710564A | 1982-01-20 | |||
| JPH01180120A | 1989-07-18 | |||
| JP2004088539A | 2004-03-18 |
Attorney, Agent or Firm:
Takayoshi Kokubun