SEMICONDUCTOR CIRCUIT

Title:

SEMICONDUCTOR CIRCUIT

Document Type and Number:

Japanese Patent JPH0629430

Kind Code:

A

Abstract:

PURPOSE: To employ a resin mold for lowering the packaging cost of an IC and reduce deterioration of high frequency characteristics of the IC.

CONSTITUTION: There are formed a first protective film 15 for securing reliability on the surface of a semiconductor integrated circuit(IC), and a second protective film 30 for reducing the deterioration of high frequency characteristics on the same. The second protective film 30 is composed of a material having a smaller dielectric constant than that of a resin molding material. Hereby, the second protective film having a lower dielectric constant enters between electrodes of an active element in the IC, and hence the resin molding material of a higher dielectric constant is prevented from entering, so that the second protective film restricts an increase of interelectrode capacitance to reduce the deterioration of high frequency characteristics.

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Inventors:

YOSHIMASU TOSHIHIKO

Application Number:

JP18088192A

Publication Date:

February 04, 1994

Filing Date:

July 08, 1992

Export Citation:

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Assignee:

SHARP KK

International Classes:

H01L23/29; H01L23/31; (IPC1-7): H01L23/29; H01L23/31

Attorney, Agent or Firm:

Shintaro Nogawa

Next Patent: DIGITAL DATA PROCESSOR