Title:
SEMICONDUCTOR COMPOUND DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2007000961
Kind Code:
A
Abstract:
To load the same substrate with a semiconductor element and a micro-electromechanical device by manufacturing the semiconductor element and the micro-mechanical device on the same substrate, and then forming wiring for connecting the semiconductor element and the micro-mechanical device to each other.
This semiconductor compound device 1 includes: a semiconductor element 21 formed on the substrate 11; an insulating film 41 formed on the substrate 11 to cover the semiconductor element 21; the micro-electromechanical device 31 formed on the insulating film 41; and a wiring layer 50 for connecting the semiconductor element 21 and the micro-electromechanical device 31 to each other. The device solves the above problem.
Inventors:
MITARAI TAKASHI
IKEDA KOICHI
TADA MASAHIRO
AKIBA AKIRA
MORITA SHINYA
IKEDA KOICHI
TADA MASAHIRO
AKIBA AKIRA
MORITA SHINYA
Application Number:
JP2005183181A
Publication Date:
January 11, 2007
Filing Date:
June 23, 2005
Export Citation:
Assignee:
SONY CORP
International Classes:
B81C1/00; B81B7/02
Domestic Patent References:
| JP3335707A | ||||
| JP2005125484A | 2005-05-19 | |||
| JP2000090801A | 2000-03-31 |
Attorney, Agent or Firm:
Funabashi Kuninori