To provide a means for easily forming a thin layer of thermal conduction member according to the application conductions of the thermal conduction member in a cooler type for a high-density mounted electronic device, wherein a heat sink is thermally connected via thermal conduction member to various semiconductor elements mounted on a substrate.
In a cooling structure, in which a heat sink 1 is thermally connected to a semiconductor element 3 via a thermal conduction member 4, an electrical resistor 5 such as a metal wire is provided in the interior of the thermal conductor member 4. The resistor 5 has a wire diameter not larger than the thickness of the thermal conductor member and is provided at both ends with electrodes, and at bonding of the semiconductor element 4 to the heat sink 1, it is possible to have the thermal conduction member 5 heated.
ASHIWAKE NORIYUKI
NISHIHARA ATSUO
