Title:
SEMICONDUCTOR COOLING UNIT
Document Type and Number:
Japanese Patent JP2005057102
Kind Code:
A
Abstract:
To provide a semiconductor cooling unit with excellent heat radiation efficiency and high shape accuracy.
The semiconductor cooling unit is composed by combining a semiconductor module 10 including a semiconductor element 11 for power and a cooling tube 20 in a flat shape provided with a hollow part 21 for making a coolant flow. The semiconductor cooling unit is provided with a base unit 2 for which the semiconductor module 10 arranged between a pair of the cooling tubes 20 facing each other and the pair of the cooling tubes 20 are integrally covered with molded resin 100.
Inventors:
EBIHARA JIRO
NORO SHINYA
NAKANO TOMOAKI
KATO JUNJI
NORO SHINYA
NAKANO TOMOAKI
KATO JUNJI
Application Number:
JP2003287397A
Publication Date:
March 03, 2005
Filing Date:
August 06, 2003
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/29; H01L23/473; (IPC1-7): H01L23/29; H01L23/473
Attorney, Agent or Firm:
Yoshiyasu Takahashi
Tamiwa Iwakura
Tamiwa Iwakura
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