Title:
SEMICONDUCTOR DEVICE, AND APPARATUS AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3129272
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate unstable bonds and poor productivity, by making the left and right sides of the distal end face of a bonding tool smaller than the left and right sides of a rectangular electrode, and the upper and lower sides of the former wider than the width of the upper and lower sides of the latter.
SOLUTION: An inner lead 2A and a pad 5 are pressed by a bonding tool 1. The lead 2A that is narrower than the width of the opening of a passivation film 4 is inserted into the opening. The distal end of the tool 1 is larger than the width of the lead 2A as viewed in the direction orthogonal to the lead 2A, and shorter than the length of the opening of the film 4 as viewed in the direction parallel with the lead 2A. Using this tool 1, the inner lead portion is brought into contact with the pad 5. Ultrasonic wave is applied to thereby remove an oxide film at the bond, and, as the final step, the bonding of the lead 2A is completed by increasing the pressure without applying ultrasonic wave. As a result, unstable bonds and poor productivity can be totally eliminated.
Inventors:
Lacquer Island Michitaka
Application Number:
JP1546298A
Publication Date:
January 29, 2001
Filing Date:
January 28, 1998
Export Citation:
Assignee:
NEC
International Classes:
H01L21/60; B23K20/10; (IPC1-7): H01L21/60
Domestic Patent References:
| JP9129809A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)