Title:
SEMICONDUCTOR DEVICE AND APPARATUS FOR MOUNTING THE SEMICONDUCTOR DEVICE ON CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3499392
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily realize a high density package in a simple structure, by bending a metal circuit board, wiring pads on semiconductor elements to circuit board patterns, and molding and sealing it with a resin.
SOLUTION: A patterned part of a circuit board 10 is machined to form bent and protrudent parts using a press, etc. Bonding pads 15 are formed at a central surface portion of a semiconductor element 14. The circuit board 10 is fixed to the surface of the element 14 through adhesives 16 so that the pads 15 on the element 14 are exposed through through-holes 13 and connected to the pattern on the surface of the board 10 through wires 17. The peripheries of the through-holes 13 and wires 17 are sealed and molded with a resin 18 to complete a semiconductor device which is then mounted on the circuit board 10.
Inventors:
Tadashi Yamaguchi
Application Number:
JP2742497A
Publication Date:
February 23, 2004
Filing Date:
February 12, 1997
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L23/495; H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP88389A | ||||
| JP5136312A | ||||
| JP3174749A | ||||
| JP547957A | ||||
| JP7321244A | ||||
| JP5136312U | ||||
| JP64334U |
Attorney, Agent or Firm:
Mamoru Shimizu (1 person outside)