Title:
SEMICONDUCTOR DEVICE AND CARRIER FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3676091
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device having a structure wherein semiconductor elements are sealed with a cap.
SOLUTION: In a semiconductor device 100 comprising a substrate 102, semiconductor elements 106 disposed on the substrate 102, a cap 112 disposed on the substrate 102 for sealing the semiconductor elements 106, and a joint 113 formed on the cap 112 and bonded to the substrate 102, the joint 113 is provided at a position near the semiconductor elements 106.
Inventors:
Atsuwa Shimizu
Application Number:
JP22588298A
Publication Date:
July 27, 2005
Filing Date:
August 10, 1998
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/40; H01L21/50; H01L23/02; H01L23/04; (IPC1-7): H01L23/02; H01L21/50; H01L23/40
Domestic Patent References:
| JP59041857A | ||||
| JP58092241A | ||||
| JP55062752A | ||||
| JP10032305A | ||||
| JP9298275A | ||||
| JP7273274A | ||||
| JP7254663A | ||||
| JP5041471A | ||||
| JP5013604A | ||||
| JP1286455A |
Attorney, Agent or Firm:
Tadahiko Ito
Previous Patent: EARTH CRUSHER AND EARTH CRUSHER LOADED SOIL IMPROVEMENT DEVICE
Next Patent: SURFACE DEFECT INSPECTING DEVICE
Next Patent: SURFACE DEFECT INSPECTING DEVICE