Title:
半導体装置、チップＩＤの付与方法及びその設定方法
Document Type and Number:
Japanese Patent JP5865642
Kind Code:
B2
Abstract:
A semiconductor apparatus having first and second chips includes a first operation unit disposed in the first chip, and is configured to perform a predetermined arithmetic operation for an initial code according to a first repair signal and generate a first operation code; and a second operation unit disposed in the second chip, and configured to perform the predetermined arithmetic operation for the first operation code according to a second repair signal and generate a second operation code.
Inventors:
Chun Suk Chung
Jee Jin Yi
Jee Jin Yi
Application Number:
JP2011209113A
Publication Date:
February 17, 2016
Filing Date:
September 26, 2011
Export Citation:
Assignee:
SK hynix Inc.
International Classes:
G06F12/06; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2011081888A | ||||
| JP2011081730A | ||||
| JP2011081884A | ||||
| JP2009134846A | ||||
| JP2012003797A |
Attorney, Agent or Firm:
Kunio Ueda
Noriharu Fujita
Kawakami Miki
Noriharu Fujita
Kawakami Miki