Title:
SEMICONDUCTOR DEVICE AND DESIGN SUPPORT METHOD FOR ELECTRONIC DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP3731515
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To overcome a problem that, to mount a component such as a bypass capacitor or an EMI filter on all power supply terminals and GND terminals, the number of these surface mount components and the mount area are increased, which increases costs and makes it difficult to miniaturize the semiconductor device.
SOLUTION: There is provided, for example, a semiconductor device in which power supply noise intensity or countermeasure priority is set for each power supply or GND terminal, or each group of power supply terminals or GND terminals of a semiconductor device.
Inventors:
Satoshi Nakamura
Taku Suga
Atsushi Nakamura
Yokota etc.
Atsushi Hara
Koichi Uesaka
Tatsuji Noma
Makoto Torigoe
Taku Suga
Atsushi Nakamura
Yokota etc.
Atsushi Hara
Koichi Uesaka
Tatsuji Noma
Makoto Torigoe
Application Number:
JP2001277424A
Publication Date:
January 05, 2006
Filing Date:
September 13, 2001
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G06F17/50; H01L23/00; H01L21/82; H01L23/544; H01L21/00; H01L23/552; H05K1/02; H05K1/18; H05K3/00; (IPC1-7): H01L23/00; G06F17/50; H01L21/82
Domestic Patent References:
| JP2000074969A | ||||
| JP7147464A | ||||
| JP7152824A | ||||
| JP2001134626A | ||||
| JP2001155048A |
Attorney, Agent or Firm:
Yasuo Sakuta