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Title:
SEMICONDUCTOR DEVICE AND ELECTRIC VEHICLE
Document Type and Number:
Japanese Patent JP2008235834
Kind Code:
A
Abstract:

To provide a semiconductor device capable of simplifying circuit configuration.

A Peltier element 51 is arranged, in such a way that an electrically conductive plate 112A that forms the heat absorbing part thereof sticks to an insulating layer 110 and an electrically conductive plate 112B that forms the heat dissipation part thereof sticks to an insulating layer 114. The Peltier element 51 is electrically connected, in such a way that one end thereof is connected to a branch line BL that is branched from a power line PL, and the other end thereof is connected to an electrode plate 108. The Peltier element 51 receives a part of the electric power that has flowed to a power transistor Q1 from the branch line BL and outputs to the electrode plate 108. Namely, the Peltier element 51 absorbs the heat generated by the power transistor Q1 and dissipates the heat to a heat dissipating plate 116 side, by using a part of the electric power flowed to the power transistor Q1.


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Inventors:
YOSHIDA TADASHI
OSADA YUJI
YOKOI YUTAKA
Application Number:
JP2007077471A
Publication Date:
October 02, 2008
Filing Date:
March 23, 2007
Export Citation:
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Assignee:
TOYOTA MOTOR CORP
International Classes:
H01L23/38; B60L9/18
Domestic Patent References:
JPH11214598A1999-08-06
JP2002289752A2002-10-04
JP2000340723A2000-12-08
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Tadashi Muto



 
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