Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2023038266
Kind Code:
A
Abstract:
To provide a semiconductor device that is manufacturable without influence of a size of a growth substrate, and an electronic apparatus.SOLUTION: A semiconductor device of one embodiment disclosed herein includes: a first substrate including a device region and a peripheral region, the device region having a first wiring layer and a first semiconductor layer including a compound semiconductor material, the peripheral region being disposed outside the device region; and a second substrate having a second semiconductor layer and a second wiring layer including a read-out circuit, the first wiring layer and the second wiring layer being stacked so as to be opposite to each other, the second substrate being electrically connected to the first substrate. The first substrate has a buried layer provided over the device region and the peripheral region so as to cover surroundings of the first semiconductor layer.SELECTED DRAWING: Figure 1B
Inventors:
Saito Takashi
Fujii
Ryosuke Matsumoto
Yoshifumi Zaizen
Shuji Manda
Maruyama Shunsuke
Hideo Shimizu
Fujii
Ryosuke Matsumoto
Yoshifumi Zaizen
Shuji Manda
Maruyama Shunsuke
Hideo Shimizu
Application Number:
JP2023003152A
Publication Date:
March 16, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
H01L27/146; H01L27/144; H01L31/10
Attorney, Agent or Firm:
Patent Attorney Corporation Tsubasa International Patent Office
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