Title:
SEMICONDUCTOR DEVICE EQUIPPED WITH LEAD-FREE TIN-BASED SOLDER FILM AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3402228
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with an electronic component lead frame which is free from lead that is an environment contaminating substance, satisfactory in solder wettability and bonding strength, and a manufacturing method thereof.
SOLUTION: A lead frame is formed of nickel, nickel alloy, copper, copper alloy, iron, or iron alloy and is equipped with inner leads 2 coated with a surface treatment layer of silver or alloy which contains silver and outer leads 1 coated with an alloy surface treatment layer which contains silver and tin that is of body-centered tetragonal structure and preferentially oriented to a (101) plane and/or a (211) plane.
Inventors:
Takashi Kuhara
Matsuo Masuda
Go Tokiwa
Hisahiro Tanaka
Matsuo Masuda
Go Tokiwa
Hisahiro Tanaka
Application Number:
JP33541698A
Publication Date:
May 06, 2003
Filing Date:
November 26, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23K35/14; B23K35/26; C22C13/00; C25D5/02; C25D5/10; C25D7/00; C25D7/12; H01L23/50; (IPC1-7): H01L23/50; C25D7/12
Domestic Patent References:
| JP60147148A | ||||
| JP6026691A | ||||
| JP58197291A | ||||
| JP55138093A | ||||
| JP1072694A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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