Title:
SEMICONDUCTOR DEVICE HAVING BURIED WIRING AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2606132
Kind Code:
B2
Abstract:
PURPOSE: To electrically connect a semiconductor substrate with wirings buried in the semiconductor substrate, without using a process for forming a fine contact hole pattern.
CONSTITUTION: When wirings (buried bit lines BL (15) buried in a silicon substrate 1 are formed, semiconductor substrate regions 1-2a protruding on the side of trenches for burying the bit lines are formed, and the silicon substrate 1 is connected with the wirings. Thereby the silicon substrate 1 can be conducted with the wirings without using a process for forming a fine contact hole pattern.
Inventors:
Tatsuya Matano
Application Number:
JP11639694A
Publication Date:
April 30, 1997
Filing Date:
May 30, 1994
Export Citation:
Assignee:
NEC
International Classes:
H01L23/52; H01L21/3205; H01L21/8242; H01L27/10; H01L27/108; (IPC1-7): H01L27/108; H01L21/3205; H01L21/8242
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)