SEMICONDUCTOR DEVICE INSPECTION METHOD - MITSUMI ELECTRIC CO LTD

Title:

SEMICONDUCTOR DEVICE INSPECTION METHOD

Document Type and Number:

Japanese Patent JP2007208138

Kind Code:

A

Abstract:

To provide a semiconductor device inspection method that electrically inspects a semiconductor device heated to a predetermined temperature so that the electrical inspection of the semiconductor device may be performed with a high degree of accuracy.

When a semiconductor device 26 is heated to a predetermined temperature Tx using a first heating means 16 so that the temperature may become a second temperature T2higher than a first temperature T1to which a support substrate 34 is heated through the influence of the first heating means 16, the second heating means 41 is used to heat the substrate 34, thus carrying out the electrical inspection of the semiconductor device 26.

Inventors:

YAMADA TOSHIHIKO

Application Number:

JP2006027449A

Publication Date:

August 16, 2007

Filing Date:

February 03, 2006

Export Citation:

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Assignee:

MITSUMI ELECTRIC CO LTD

International Classes:

H01L21/66; G01R31/26; G01R1/073

Attorney, Agent or Firm:

Tadahiko Ito

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