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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND ITS FABRICATING METHOD
Document Type and Number:
Japanese Patent JP2004079817
Kind Code:
A
Abstract:

To obtain a semiconductor device capable of increasing capacity of a capacitor.

There is provided the semiconductor device equipped with a first interlayer insulating film 3 formed on a semiconductor substrate 1, a lower electrode contact plug 5 formed by penetrating the first interlayer insulating film 3, a second interlayer insulating film 6 formed on the first interlayer insulating film 3, and a capacitor section 43 comprising a lower electrode formed in an opening 41 penetrating the second interlayer insulating film 6 to reach the lower electrode contact plug 5, a dielectric film, and an upper electrode. Further, an auxiliary insulative protrusion 42 is provided in part of an upper portion of the lower electrode contact plug 5, and further the capacitor section 43 is formed along an upper portion of the auxiliary insulative protrusion 42 inside the capacitor opening 41.


Inventors:
ITO KOJI
SOEDA SHINYA
Application Number:
JP2002238772A
Publication Date:
March 11, 2004
Filing Date:
August 20, 2002
Export Citation:
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Assignee:
RENESAS TECH CORP
RENESAS SEMICONDUCTOR ENGINEER
International Classes:
H01L21/8242; H01L27/108; (IPC1-7): H01L21/8242; H01L27/108
Attorney, Agent or Firm:
Toshihide Kodama
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami