To provide a semiconductor device having a mark for measurement capable of dealing with process variation while having one predetermined shape and suppressing increase in the occupancy of a mark arranging region, and to provide its fabricating process and a photomask.
An outer box mark is a multiple box mark BMK 1. An inner box mark BMK 2 is formed on a metal member ML covering the multiple box mark BMK 1. It is an alignment mark with the multiple box mark BMK 1 and has a square resist pattern. The multiple box mark BMK 1 is formed by quardruplicating a plurality of square frames (F1-F4) of different width in stripe on the insulating film IL above a semiconductor substrate and arranging a metal member PM in a plurality of trenches TR1-TR4 of different width.
Masaaki Utsunomiya
Atsushi Watanabe
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