To provide a semiconductor device which has a size equal to that of its semiconductor element and can be manufactured easily at low cost and in which required electrical connection can be accomplished surely, even if the electrode arranging pitch of the semiconductor element is small.

A semiconductor device is provided with a substrate 30 and a semiconductor element 10 which is integrally provided on one surface of the substrate 30 via a sealing layer 20 and has a plurality of pad electrodes 11 on its surface facing the sealing layer 20. The substrate 30 substantially has the same size as that of the element 10, and at the same time, a plurality of connecting electrodes 31 which are arranged, in a way in which the electrodes 31 respectively correspond to the pad electrodes 11. The sealing layer 20 is composed of a hardening resin, containing conductive particles which are scattered in the sealing layer 20 in a state in which the particles are oriented in the thickness direction of the layer 20. The pad electrodes 11 are electrically connected to their corresponding connecting electrodes 31 via the conductive paths formed of the conductive particles.