Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2001358168
Kind Code:
A
Abstract:
To provide a semiconductor device and its manufacturing method, which effectively prevents short circuit of wires and realizes an efficient manufacturing process with little labor.
Chip electrodes la of a semiconductor chip 1 are connected to connecting terminals 2 for outer circuits via bonding wires 3, at least a part of or the entire bonding wire 3 is coated with a reinforcing material 4, and regions including the bonding wires 3 and the connecting terminals 2 are coated or are sealed with resin 5.
Inventors:
TATSUMI KOHEI
TERAJIMA SHINICHI
YAMAMOTO YUKIHIRO
UNO TOMOHIRO
TERAJIMA SHINICHI
YAMAMOTO YUKIHIRO
UNO TOMOHIRO
Application Number:
JP2000174909A
Publication Date:
December 26, 2001
Filing Date:
June 12, 2000
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
H01L23/29; H01L21/60; H01L23/31; (IPC1-7): H01L21/60; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Shunta Naito (1 outside)
Previous Patent: SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Next Patent: STRUCTURE FOR SEMICONDUCTOR ELEMENT MOUNTING
Next Patent: STRUCTURE FOR SEMICONDUCTOR ELEMENT MOUNTING