To provide a semiconductor device capable of realizing its miniaturization and high integration at a low cost, and to provide its manufacturing method and a semiconductor package.
The semiconductor device 1 comprises a first semiconductor package 2 including a first semiconductor chip 9 and a second semiconductor package 3 including a second semiconductor chip 14 different from the first semiconductor chip 9 stuck one on the other. Further, a plurality of packages each including a semiconductor chip are stuck, and at least lower stage semiconductor packages 2 and upper stage semiconductor packages 3 among these packages have a different size, respectively. The manufacturing method is adapted such that conductive paste 18 is applied to adhere onto a chip substrate 12 of the upper stage semiconductor package 3 smaller in external configuration size, and a solder ball 11 onto a chip substrate 6 of the lower stage semiconductor package 2 larger in external configuration size. Thereafter, the conductive paste 18 and the solder ball 11 are fused to achieve the foregoing sticking.
HASEGAWA KIYOSHI
OTA KAZUYA
ONO YOSHIHIRO
KOIKE TOSHIHIKO
SATO KAZUHIRO
SUGIMOTO TADASHI
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