To provide a semiconductor device which can specify whether failure occurred in which source position of a semiconductor substrate only by checking a semiconductor chip divided from the semiconductor substrate when failure occurs in the semiconductor chip, and to provide its manufacturing method.

In the semiconductor device which can specify a failure occurrence position in a semiconductor substrate 1 after semiconductor chips 2 arranged in a matrix shape in the semiconductor substrate 1 are divided, the semiconductor chip 2 is provided with a circuit 3, a common mark 4 which is formed in a region except the circuit 3 and shows the whole lay out of the semiconductor chips 2 in the semiconductor substrate 1, and an individual mark 5 which is formed in the common mark 4 and shows position of the semiconductor chip 2 in the semiconductor substrate 1.