To provide a highly reliable semiconductor device receiving a solid imaging element in a package whose mounting area is more reduced, and reflow mounting, and also to provide its manufacturing method.
The semiconductor device comprises: a translucent substrate 11 having at least a transparent electrode 12 and a transparent electrode pattern 13; the solid imaging element 14 having an electrode region 15 around the main surface side and provided with a space S between the electrode region 15 and the translucent substrate 11, since the electrode region 15 is connected electrically to the transparent electrode 12; a circuit substrate 21 arranged on the rear surface side of the solid imaging element 14, and provided with a connecting unit 22 connected to the translucent substrate 11 while being provided with the signal transfer route of the solid imaging element 14 formed thereon; and a plurality of external terminals 28 provided on the external mounting surface of the circuit substrate 21 and having respective connecting relation with the signal transfer route.
Fujitsuna Hideyoshi
Osamu Suzawa
Next Patent: CONNECTING METHOD OF WIRING SUBSTRATE AND SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD OF SEMICONDUCT...