Title:
SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, ELECTRONIC MODULE, AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP3736638
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of the electric connection of a lead and an electrode.
SOLUTION: A semiconductor device includes a substrate 20 on which a plurality of leads 22 are formed, and a semiconductor chip 10 mounted on the substrate 20 such that the surface of the semiconductor device having a plurality of electrodes 14 faces the substrate 20. Each lead 22 includes a first part 24 joined to any electrode 14 and a second part 26 of a region overlapping the semiconductor chip 10 taken out from the inside to the outside. The second part 26 is bent and is adapted to wholly adhere to the substrate 20.
Inventors:
Uchida Masami
Application Number:
JP2003358077A
Publication Date:
January 18, 2006
Filing Date:
October 17, 2003
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L23/12; H01L21/60; H01L23/498; H05K1/11; (IPC1-7): H01L23/12; H01L21/60
Domestic Patent References:
| JP2002184812A | ||||
| JP4287937A | ||||
| JP2004274007A |
Attorney, Agent or Firm:
Inoue Ichi
Yukio Fuse
Mitsue Obuchi
Yukio Fuse
Mitsue Obuchi