Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JPH07202106
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor device which can increase as much as possible the size of a semiconductor chip in a package of preset outer dimensions.
CONSTITUTION: There is a height difference between a first parting surface 19 of a lead terminal 4 of a package for a semiconductor chip and a second parting surface 18 of a die pad lifting lead 7 supporting the die pad. A parting line 20 connecting the first parting surface 19 to the second parting surface 18 is provided where a lead terminal does not protrude on the side of the package other than corner ridge lines.
Inventors:
UEDA TETSUYA
MICHII KAZUNARI
KOYAMA YUTAKA
UEDA NAOTO
MICHII KAZUNARI
KOYAMA YUTAKA
UEDA NAOTO
Application Number:
JP35084093A
Publication Date:
August 04, 1995
Filing Date:
December 29, 1993
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/28; H01L21/56; H01L23/50; (IPC1-7): H01L23/50; H01L21/56; H01L23/28
Attorney, Agent or Firm:
Soga Doteru (6 people outside)
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