Title:
SEMICONDUCTOR DEVICE AND ITS MOUNTER
Document Type and Number:
Japanese Patent JP3813120
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily be mounted on a substrate and its mounter.
SOLUTION: The semiconductor device (2) has a package body (4) including a semiconductor element and a plurality of lead wires (6) which are led out from at least two opposite sides of the package body (4). The package body (4) has one or more through holes (8), and the plurality of lead wires (6) are curved in the adjoining places of ends far from the package body (4). When the semiconductor device (2) is mounted on the substrate (10), the package body (4) and the substrate (10) are arranged opposite to each other and coupled together by making one or more screws (12) penetrate through holes (8) of the package body (4) and through holes bored in the substrate (10) to hold the package body (4) and the substrate (10) at a specified interval, thereby pressing the curved parts of the lead wires (6) against a wiring pattern (14) provided on the surface of the substrate (10).
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Inventors:
Noritaka Tamaya
Komei
Komei
Application Number:
JP2002345558A
Publication Date:
August 23, 2006
Filing Date:
November 28, 2002
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/50; H05K7/20; H01L23/40; H05K1/18; (IPC1-7): H01L23/50; H01L23/40; H05K1/18; H05K7/20
Domestic Patent References:
| JP3125468A | ||||
| JP1163390U | ||||
| JP56078566U |
Attorney, Agent or Firm:
Aoyama Aoi
Osamu Kawamiya
Masahiro Ishino
Osamu Kawamiya
Masahiro Ishino
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