SEMICONDUCTOR DEVICE, ITS PRODUCTION AND TAPE CARRIER FOR SEMICONDUCTOR DEVICE USED FOR PRODUCTION OF THE SEMICONDUCTOR DEVICE

Title:

SEMICONDUCTOR DEVICE, ITS PRODUCTION AND TAPE CARRIER FOR SEMICONDUCTOR DEVICE USED FOR PRODUCTION OF THE SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPH08335653

Kind Code:

A

Abstract:

PURPOSE: To prevent the generation of defective electrical connection by filling at least a space between a semiconductor chip and an auxiliary wiring plate piece with a fusion-bondable polyimide resin layer.

CONSTITUTION: The entire area excluding a circuit formation surface of a semiconductor chip 1 (an area on the electrode 11 side) is encapsulated with a resin 4, and a space between the chip 1 and auxiliary wiring plate piece 2 is filled with a thermal sticking polyimide resin layer 3. The resin 3 strongly adheres to the chip 1 and wiring plate piece 2, therefore, when a semiconductor device is mounted on a circuit board by welding, any space between the chip 1 and layer 3 caused by such a heat treatment is hardly generated. A formation material for the layer 3 is preferably a fusion-bondable polyimide resin with a glass transition temperature of at most 300°C. Thus, the generation of electrical connection of a semiconductor device can be prevented.

Inventors:

IGARASHI KAZUMASA
NAGASAWA TOKU
TANIGAWA SATOSHI
USUI HIDEYUKI
YOSHIO NOBUHIKO
ITOU HISATAKA
OKAWA TADAO

Application Number:

JP28364295A

Publication Date:

December 17, 1996

Filing Date:

October 31, 1995

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

C08G73/10; H01L21/56; H01L23/12; H01L23/28; H01L23/29; H01L23/31; H01L23/498; (IPC1-7): H01L23/29; H01L23/31; C08G73/10; H01L23/12; H01L23/28

Attorney, Agent or Firm:

Nishihiko Yasuhiko

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