Title:
SEMICONDUCTOR DEVICE AND LASER EQUIPMENT
Document Type and Number:
Japanese Patent JP2017017297
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing the formation of a warp in a support member.SOLUTION: A semiconductor device includes: two semiconductor elements (10A and 10B); a support member 20 supporting the two semiconductor elements (10A and 10B). The support member 20 is formed by an insulation member 21 and two metal members (22 and 23) which has thermal expansion coefficient different from that of the insulation member 21 and sandwiches the insulation member 21. The support member 20 includes concave parts (31, 32, and 33) of which a part of the support member 20 is eliminated in a surface of the side (+Z side ) to which the semiconductor elements 10A and 10B in the support member 20 are supported and a surface (-Z side) opposite to the side.SELECTED DRAWING: Figure 3
Inventors:
YONEDA YUTAKA
HIROI MASAKI
HIROI MASAKI
Application Number:
JP2015135812A
Publication Date:
January 19, 2017
Filing Date:
July 07, 2015
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
H01S5/022; H01L23/12; H01L23/13; H01L23/36; H01S5/40
Attorney, Agent or Firm:
Atsushi Tateishi