PURPOSE: To enhance a semiconductor device mounting pad in adhesion to resin and to improve molding resin in crack-resistance to thermal shock by a method wherein a part of the semiconductor device mounting pad is curved.

CONSTITUTION: A semiconductor chip is mounted on a semiconductor device mounting pad 2 which is bent downward at its periphery, and the chip is connected to inner leads 5 with conductive fine wires. As mentioned above, the part of the semiconductor device mounting pad 2 is curved, whereby the semiconductor device mounting pad 2 can be improved in adhesion to resin, and as a lead frame processed as above can be relaxed in both lateral and upward stress induced by thermal expansion coefficient difference between resin and the lead frame and enhanced in adhesion to resin, molding resin can be enhanced in crack-resistance to thermal shock.