PURPOSE: To provide a manufacture of a semiconductor device equipped with a gate insulating film being made at a low temperature and small in interface level.
CONSTITUTION: A polycrystalline silicon film 2 is made on a transparent insulating substrate 1. An extremely thin oxide film 3 approximately 50-100 is made on the polycrystalline silicon film by irradiation with UV-O3, oxidation in steam, RTA treatment in oxidizing gas atmosphere, etc. An insulating film 4 such as a silicon oxide film, silicon nitride film, or the like is made on the oxide film 3. A gate insulating film 5 is composed of the oxide film 3 and the insulating film 4. The whole face of the device is trradiated with light by RTA method. By this RTA method, the reduction of the level of interface between the polycrystalline silicon film 2 and the oxide film 3, the improvement of the film quality of the insulating film 4, and the improvement of the crystal property of the polcrystalline silicon film 2 can be materialized.
TAGUCHI EIJI
ODA NOBUHIKO
SEGAWA YASUO