SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF AND MANUFACTURE OF LEAD FRAME

Title:

SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF AND MANUFACTURE OF LEAD FRAME

Document Type and Number:

Japanese Patent JPH08306853

Kind Code:

A

Abstract:

PURPOSE: To provide a semiconductor device having resin-sealed semiconductor chip and lead, manufacture thereof and manufacture of a lead frame used for the semiconductor device, wherein reliability of the semiconductor chip, standardization of an external electrode terminal, reduction in manufacturing cost and improvement in production efficiency may be realized.

CONSTITUTION: A semiconductor device has a semiconductor chip 2 having an electrode pad 6 at a first pitch, a lead 3 electrically connected with the electrode pad 6 via a wire 8, and seal resin 4 for sealing the semiconductor chip 2. In this semiconductor device, a protrusion 9 to be an external connection terminal is formed on the lead 3 at a second pitch different from the first pitch. The seal resin 4 seals the wire 8 arranged between the electrode pad 6 and the lead 3. Also, the protrusion 9 is exposed.

Inventors:

HAYASHIDA KATSUHIRO
SATO MITSUTAKA
UNO TADASHI
FUJISAWA TETSUYA
WAKI MASAKI

Application Number:

JP11038095A

Publication Date:

November 22, 1996

Filing Date:

May 09, 1995

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

H01L21/60; H01L21/56; H01L23/12; H01L23/28; H01L23/31; H01L23/495; H01L23/50; (IPC1-7): H01L23/50; H01L21/60; H01L23/12; H01L23/28

Attorney, Agent or Firm:

Tadahiko Ito

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