PURPOSE: To improve the mold release characteristics of a metal mold and the reliability of a semiconductor device while a miniaturization of the device is contrived in the semiconductor device, wherein a semiconductor element is resin-sealed, and a method of manufacturing the device.
CONSTITUTION: In a semiconductor device, which is provided with a semiconductor element 1, a substrate 2 to be mounted with this element 1 and a resin 3 for sealing the element 1, a resin filling hole 14 is formed in the substrate 2 and the resin 3 is introduced through the surface different from the surface, which is arranged with the element 7, of this substrate 2 via the hole 14 to seal the element 1. Accordingly, it becomes possible that the resin 3 is directly introduced on the substrate via the hole 14 to seal the element 1. Thereby, the need to provide a cull part, a runner part or the like, through which the resin 3 is hardly passed, in a metal mold like a conventional method is eliminated and it becomes possible to lessen the contact area of the resin 3 with the metal mold. As a result, the kinds of a mold release agent and the addition amount of the resin can be selected without paying regard to the mold release characteristics of the metal mold.
OOSAWA MITSUHIRO
KATOU SADATSUGU
ISHIGURO HIROYUKI
SAKURAI YUJI
NAKASEKO SHINYA
KASAI JUNICHI
TANIGUCHI SHINICHIRO
OSUMI MAYUMI
KYUSHU FUJITSU ELECTRONIC