PURPOSE: To enable bonding of wire material with good bondability to an inner section of a lead consisting of copper material even at a low temperature which can avoid fusion of a solder coating by using an aluminum material as a material to form a wire.

CONSTITUTION: A silicon semiconductor pellet 12, a plurality of leads 9 arranged around the pellet, a wire 13 whose both ends are bonded to each bonding and 12a of the pellet and an inner section 9a of each lead 9 for bridging, and a package 14 for resin sealing are provided. A group of leads 9 are formed by using a copper material and a wire 13 is formed by using an aluminum material. One end of the wire is bonded to an electrode of the pellet through ball bonding. The other end is bonded to a base material surface which consists of copper material in an inner section of each lead.