SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Title:

SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH1022435

Kind Code:

A

Abstract:

To provide a semiconductor device and manufacture thereof which enable sufficient improvement in insulating property.

A portion 22 to be an input/output terminal of a lead frame 2 connected with an electronic component, such as, a semiconductor chip 4, is bent and arranged in an upper mold 91 (c). After the portion 22 is resin-sealed, it is pulled up to be an input/output terminal (e), thereby enabling formation of an input/output terminal on the upper surface of a resin layer by a transfer mold method. Thus, even though transfer mold sealing of a thermosetting resin is carried out, a semiconductor device having an input/output terminal on a surface of a base board opposite to a heat sink surface may be easily provided. Therefore, a semiconductor device in which the dielectric strength between the input/output terminal and a cooling fin is significantly improved and which may be applied to a semiconductor module for electric power, such as, an inverter device, may be easily provided.

Inventors:

TAKAHASHI MASAAKI
OGAWA TOSHIO
YAMADA KAZUJI
AIDA MASAHIRO
KAMIMURA NORITAKA
SUZUKI KAZUHIRO
KOKADO HIROYOSHI
OGINO MASAHIKO
ISHII TOSHIAKI
SAEKI JUNICHI
TSUNODA SHIGEHARU
ENDO TSUNEHIRO
SHIGEMURA TATSUYA
KUMAZAWA TETSUO
NAKATSU KINYA

Application Number:

JP17247096A

Publication Date:

January 23, 1998

Filing Date:

July 02, 1996

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HITACHI LTD

International Classes:

H01L21/56; H01L23/50; H01L23/52; (IPC1-7): H01L23/50; H01L21/56; H01L23/52

Attorney, Agent or Firm:

Kenjiro Take

Previous Patent: LEAD FRAME FOR INTEGRATED CIRCUIT AND MANUFACTURE THEREOF

Next Patent: ADHESIVE COATER FOR LEAD FRAME