Title:
SEMICONDUCTOR DEVICE, MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP2015220428
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device having high dielectric strength, and to provide a manufacturing apparatus of the semiconductor device.SOLUTION: A semiconductor device includes: a semiconductor element 1; a frame 2 which has a first surface 2A, holds the semiconductor element 1 on the first surface 2A, and is electrically connected with the semiconductor element 1; and a sealing body 3 which has electrical insulation properties and seals the semiconductor element 1 and the frame 2. A through hole 4 is formed in the sealing body 3. The through hole 4 has a hole axis extending in a direction perpendicular to the first surface 2A. An inner peripheral end surface of the sealing body 3, which appears in an inner part of the through hole 4, inclines relative to the hole axis.
Inventors:
SHIROMIZU MASATAKA
HATA HIROKIMI
WANG YA-ZHE
HATA HIROKIMI
WANG YA-ZHE
Application Number:
JP2014105223A
Publication Date:
December 07, 2015
Filing Date:
May 21, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L25/07; H01L23/28; H01L23/29; H01L23/31; H01L25/18
Domestic Patent References:
| JP2001320185A | 2001-11-16 |
Foreign References:
| US20120086003A1 | 2012-04-12 |
Attorney, Agent or Firm:
Fukami patent office
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