Title:
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, DISPLAY DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2014170829
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits immersion of moisture into a semiconductor film and is manufactured by a simpler method; and provide a manufacturing method of the semiconductor device, a display device manufacturing method, and an electronic apparatus manufacturing method.SOLUTION: A semiconductor device manufacturing method comprises: forming a gate electrode and wiring; coating the gate electrode and the wiring with a first insulation film and forming a semiconductor film on the gate electrode across the first insulation film; coating the semiconductor film and the first insulation film with a second insulation film and patterning the second insulation film and the first insulation film by one process to form a connection hole which reaches the wiring and form a first recess at a position adjacent to the semiconductor film; and depositing a first conductive film from the connection hole to the first recess to electrically connect the first conductive film with the wiring by the connection hole and bury the fist conductive film in the first recess.
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Inventors:
AMARI KOICHI
Application Number:
JP2013041728A
Publication Date:
September 18, 2014
Filing Date:
March 04, 2013
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L21/336; G02F1/1368; G09F9/30; H01L29/786; H01L51/50; H05B33/14; H05B44/00
Attorney, Agent or Firm:
Patent business corporation wings international patent firm