SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Title:

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Document Type and Number:

Japanese Patent JP2014220509

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To achieve a reduced thickness of a semiconductor device having a multilayer structure and reduce the number of steps in semiconductor device manufacturing.SOLUTION: A photosensitive adhesive has adhesiveness to an adherend after patterning by exposure and developing and is capable of alkali development. The photosensitive adhesive is used with a manufacturing method of a semiconductor device 100 comprising a step of patterning a photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by exposure and developing; and a step of directly adhering another semiconductor chip 21 to the photosensitive adhesive 1 that has gone through patterning.

More Like This:

JP3424199	ELECTRONIC MODULE UNITED WITH SENSOR ARRAY, AND SENSOR DEVICE
WO/2023/272555	THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
JPS5867057	SEMICONDUCTOR DEVICE

Inventors:

MASUKO TAKASHI
KAWAMORI TAKASHI
MITSUKURA KAZUYUKI
KATOGI SHIGEKI

Application Number:

JP2014131514A

Publication Date:

November 20, 2014

Filing Date:

June 26, 2014

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

H01L25/065; G03F7/004; G03F7/037; G03F7/40; H01L25/07; H01L25/18

Domestic Patent References:

JP2007192936A	2007-08-02
JP2002116541A	2002-04-19
JP2004022996A	2004-01-22
JP2007302881A	2007-11-22
JP2007294767A	2007-11-08

Foreign References:

WO2007004569A1

2007-01-11

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
古下 Tomoya

Previous Patent: PROCESS OF MANUFACTURING LAMINATED SUBSTRATE

Next Patent: COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR MANUFACTURING N-TYPE DIFFUSION LAYER AND ...