Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2014154677
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a substrate processing apparatus, which can effectively resume processing on an unprocessed substrate after the occurrence of a defect during processing a substrate.SOLUTION: A semiconductor device manufacturing method of performing a recipe in which procedures for managing a processing state of a substrate and for processing the substrate are defined comprises: causing the processing state to transit to a state representing in-processing and performing the recipe; causing the processing state when a defect occurs during performing the recipe and there is an unprocessed substrate among processing target substrates by the recipe, to transit to a state representing suspension of the processing; and causing the processing state when a defect is removed and a procedure for resumption of the recipe is performed, to transit from the state representing suspension of the processing to the state representing in-processing and resuming the recipe and performing processing on the unprocessed substrate.
Inventors:
SHIRAKAWA MASATO
Application Number:
JP2013022410A
Publication Date:
August 25, 2014
Filing Date:
February 07, 2013
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/02
Domestic Patent References:
| JPH09129554A | 1997-05-16 | |||
| JPH10261554A | 1998-09-29 | |||
| JPH11111802A | 1999-04-23 | |||
| JP2009135433A | 2009-06-18 | |||
| JP2012049429A | 2012-03-08 | |||
| JP2009540540A | 2009-11-19 |
Attorney, Agent or Firm:
Patent business corporation eye Py WIN
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