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Title:
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2005322723
Kind Code:
A
Abstract:

To solve the problem, wherein in a power MOSFET formed in a conventional semiconductor device, it has been difficult to make the FET element finer than the conventional ones, while intending to improve the breakdown voltage thereof.

A semiconductor device has a first conductivity-type drift region formed on a first conductivity-type semiconductor substrate, a second conductivity-type base region formed in the predetermined region of the surface of the drift region, a first conductivity-type source region formed in the predetermined region of the surface of the base region, a contact hole reaching the base region from the side of the surface of the source region, a second conductivity-type column region, formed in the drift region present under the contact hole, a plug made of a first conductive material and embedded in the contact hole, and a wiring made of a second conductive material and connected electrically with the plug.


Inventors:
NINOMIYA HITOSHI
Application Number:
JP2004138357A
Publication Date:
November 17, 2005
Filing Date:
May 07, 2004
Export Citation:
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Assignee:
NEC ELECTRONICS CORP
International Classes:
H01L29/78; H01L21/336; H01L29/06; H01L29/15; H01L29/10; H01L29/45; (IPC1-7): H01L29/78; H01L21/336
Domestic Patent References:
JP2004282007A2004-10-07
JP2003324196A2003-11-14
JP2003318396A2003-11-07
JP2000091575A2000-03-31
JPH0194672A1989-04-13
JP2002524879A2002-08-06
JP2000040822A2000-02-08
JPH09213939A1997-08-15
Attorney, Agent or Firm:
Ken Ieiri