To provide a semiconductor device and its manufacturing method capable of assuring electronic connection of a semiconductor device to an insulating substrate (mounting substrate) without conducting filler.

The semiconductor device is provided with a semiconductor element 1 with a semiconductor circuit formed thereon, an electrode 2 formed on the surface of the semiconductor element 1 and connecting to the semiconductor circuit, an insulating substrate 5, a conductor wiring 4 formed on the surface of the insulating substrate, and a conductive bump 3 in contact with the electrode 2 and the conductor wiring. The diameter of the bump 3 is relatively shorter in the side of the semiconductor element 1 than that in the side of the insulating substrate 5. The conductor wiring 4 is disposed on the insulating substrate 5, and the bump 3 is brought into contact with the electrode 2 of the semiconductor element 1 for preferable disposition after a stud bump is connected to the conductor wiring 4.