Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2006294659
Kind Code:
A
Abstract:
To allow a light transmitting lid body to be exchanged in a semiconductor device for mounting an optical semiconductor element in a package, having a conductor for making connection to an external circuit and the light transmitting lid body for sealing an opening, and also to reduce costs.
The package 3 comprises a substrate 7 having a die attachment surface 3a for mounting the optical semiconductor element, such as a photosensor 1; and a holder 8 made of a shape memory resin for holding the light transmitting lid body 5 at the upper portion of the die attachment surface 3a stuck to the periphery of the substrate 7, thus easily mounting or exchanging the light transmitting lid body 5 by utilizing the shape memory properties of the holder 8.
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Inventors:
MATSUMOTO KATSUYOSHI
Application Number:
JP2005109284A
Publication Date:
October 26, 2006
Filing Date:
April 06, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/02; H01L27/14; H01L31/02; H04N5/335
Attorney, Agent or Firm:
Takao Itagaki
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada