To provide a semiconductor device and a manufacturing method thereof, capable of achieving a low profile of the semiconductor substrate and improving a manufacturing yield or reducing the manufacturing cost of the semiconductor device.

The semiconductor device is provided with a substrate (10), a semiconductor element (14) connected in flip-chip onto the substrate (10), and a sealing portion (28) for sealing the semiconductor element (14), wherein the semiconductor element (14) has its side surface wholly covered with the sealing portion (28) and its upper surface not covered with the sealing portion (28). Since the whole side surface of the semiconductor element (14) is covered with the sealing portion (28), the side surface of the semiconductor element can be prevented from being damaged. Further, since the upper surface of the semiconductor element (14) is not covered with the sealing portion (28), the low profile of the semiconductor device can be realized.