Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3877717
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress defective connections between a semiconductor chip and a wiring layer in a semiconductor package, and to improve reliability and yield in an element.
SOLUTION: An adhesive film 464 is formed on the surface of an electrode film 462, and a covering film 466 is formed on the adhesive film. As the component materials of the adhesive film 464 nickel, chrome, molybdenum, tungsten, aluminum, the alloy of them, and the like are used. As the component materials of the covering film 466, gold, silver, platinum, the alloy of them, and the like are used.
Inventors:
Ryosuke Usui
Mizuki Hideki
Takeshi Nakamura
Mizuki Hideki
Takeshi Nakamura
Application Number:
JP2003339123A
Publication Date:
February 07, 2007
Filing Date:
September 30, 2003
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L23/12; H01L21/68; H01L23/498; H01L25/16; H05K3/24; H01L23/31; H05K3/30; H05K3/34; H05K3/38; (IPC1-7): H01L23/12
Domestic Patent References:
| JP2000216297A | ||||
| JP2000039451A |
Attorney, Agent or Firm:
Hiroshi Kakutani
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