Title:
半導体装置の製造方法および半導体装置
Document Type and Number:
Japanese Patent JP6397806
Kind Code:
B2
Inventors:
Yuu Takano
Takeshi Watanabe
Takeshi Watanabe
Application Number:
JP2015179997A
Publication Date:
September 26, 2018
Filing Date:
September 11, 2015
Export Citation:
Assignee:
Toshiba Memory Corporation
International Classes:
H01L23/28; H01L21/28; H01L23/00
Domestic Patent References:
| JP2015115552A | ||||
| JP2014189861A | ||||
| JP2004297054A | ||||
| JP2013150014A | ||||
| JP11121961A | ||||
| JP2015015299A |
Foreign References:
| WO2016204208A1 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira